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PCB Printpladeproduktion |
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Global Circuits Board
is a well-established Hong Kong based
company backed up with Chinese
manufacturing. Since 1987 we have
manufactured and sold PCB / PWB products
in the international market place.
In order to keep ahead of the
international electronics technologies,
GCB was reorganized in 1994 by an
electronics expert with over 30 years'
experience in this field. Now the
company is operated by a group of young
but extremely experienced experts.actory
Our company therefore has a high
proficiency in the manufacturing of PCB
products, and is ready to respond to the
ever-increasing demand for high quality
electronics products in the
international market place.
Currently we are employing more than
1400 staff over the 2 manufacturing
sites to cope with the ever-increasing
demand for competitive high quality
Printed Circuit Boards.
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Company History :
1987 Company Established by founder Mr. Conder Li.
1989 Manufacturing site in Shen Zhen, China.
1995 UL certified onto full range of products included with
Multi-layer.
1998 ISO 9002 certified.
1999 Sales office established in Malaysia (Penang).
2000 Production site expansion for Multi-layer.
2001 ISO 9001 (Version 2000) certified.
2001 Sales office established in Europe (UK).
2002 Construction (Zhu Hai Factory) confirmed
2002 Sales office established in Thailand (Bangkok).
2004 Production began in Zhu Hai Factory.
2005 RoHS compliance production certified by UL.
2005 ISO14000 certified in Zhu Hai Factory.
Coming Development :
2006 To be certified with the TS 16949 standard |
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Certification and Industry Quality Standard |
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Certification
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All GCB products meet
international standards in
accordance with MIL, IPC, UL and
RoHS. We also conform to
the quality standard ISO 9000
and ISO14000 by DNV.
We are now a well established
company dealing with famous
worldwide clients, which proves
we are one of the leading PCB
manufacturers in Far East Asia.
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Industry
Quality Standard
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IPC-A-600F, IPC-D-300G &
MIL-STD-105D Level II
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Technology and Capability
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PCB Technology & Capability
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Descriptions |
Technology & Capability |
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Product Range |
Rigid Printed Circuits Board,
single sided up to 10 layers |
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Min. Board Thickness |
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Single Side |
Double Side |
Multi-layer |
0.8 mm min.
Paper Phenolic
(i.e. : FR-1) |
0.20 mm min.
Glass Epoxy
(i.e. FR-4)
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4
layer
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6
layer
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8
layer
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10
layer
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0.40mm |
1.00mm |
1.20mm |
1.50mm |
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Max. Board Size |
508 x 610 mm ( 20" x 24" ) |
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Base Material |
FR-4, CEM-3, CEM-1, FR-1, FR-2,
XPC,
"HALOGEN
FREE, HIGH CTI, HIGH Tg, by
special order" |
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Base Copper Foil |
0.5 oz to 3 oz for Glass Epoxy
laminate, 1 oz for Paper
Phenolic,
0.5 oz minimum copper design for
inner-layer |
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Major Laminate |
Kingboard, Doosan, ShengYi |
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Types of Surface Finish |
Flash gold (Electrolytic), Hard
gold plating,
Electroless nickel Immersion
gold (Electroless Ni/Au),
Organic Solderability
Preservatives (Entek), Hot Air
Leveling (Tin/Lead),
Hot Air Leveling (Pb Free),
Carbon Ink, Peelable Mask. Gold
Fingers (30µ"), Silver Paste |
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Min. Drill Bit Size |
0.2 mm (finished) , Aspect
Ratio=8 |
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Via Holes |
COPPER PTH, Blind Via / Buried
Via |
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Impedance Control Tol |
+/- 10% (min. +/- 7 Ohm) |
Min. Line
Width & Spacing |
0.10 mm / 0.10 mm ( 4 mil / 4
mil ) |
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Soldermask |
Liquid Photo-image (LPI),
Silkscreen Ink : Thermal Cure,
UV Cure |
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Profile |
Routing, Punching, Push Back,
CNC V-cut, Connector Chamfering |
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Fabrication Data Inputs
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Type |
Preferred |
Usable |
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Gerber Electronic Files |
RS-274-X or RS-274-D |
GC-CAM / View2000 |
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Print Files |
HPGL |
Gerber, DXF, Auto Cad |
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Drill Files |
ASCII |
Excellon, Gerber, Trudrill |
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Aperture List |
Standard Wheel with D-code List |
If RS-274-D is used |
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TOP |
Pre-Production Engineering
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Once we receive the purchase order,
Gerber files, drill files with
fabrication drawing, the first step is
to perform CAM review to ensure
compliance to GCB guidelines and quality
control standards. In case of design /
board requirement conflict, we will
inform our MKT to contact the customer
for resolve. Then the files will be
transferred to Laser Plot for artwork
generation. |
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TOP |
Fabrication Drawing
Information
Considerations
during the Design Process
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1 |
Material information including :
material type, copper weight,
any special considerations.
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Hole size information including
: finished size and tolerance,
plate thru or non - plate thru. |
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3 |
Board size including : length
and width, hole to edge. |
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Solder mask requirements if
there is any special
consideration. |
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Tolerance block for dimensions. |
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Board thickness and tolerance. |
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Finish requirements.
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Array drawing (sub. panel) |
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The drawing should be included
length and width dimensions,
hole to edge dimension, datum
hole (0-0 location), tooling
hole locations, cutout
locations, slot locations, bevel
requirements. |
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TOP |
Multilayer Board Lay-up
Considerations
during the Design Process
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1 |
Layer Stackup : |
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a) |
When possible, specify
copper weight
identically for each
layer throughout the
stack up. |
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b) |
Lay-up sequence must be
specified. |
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c) |
Free lay-up is preferred.
Generally specify
overall thickness only
so that standard
materials can be used. |
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d) |
If lay-up construction
is specified, balance
the dielectric spacing
is recommended. So that
it is symmetrical in the
Z axis. (These steps
help reduce warpage.) |
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e) |
1~2 oz copper for inner
layers is standard.
Other claddings are
available from our
suppliers 3 oz etc...
These thickness may
require additional lead
time. |
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f) |
For controlled impedance
boards, specify overall
finish thickness and
tolerance, layer
sequence and calculated
dielectric's between
layers. Specify designed
trace width and
impedance value for each
layer. We will run a
model and verify that
the calculations are
correct. |
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Innerlayers :
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a) |
Ground and power
layers : |
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i. |
Clearance pads (unclad
area) must be a
minimum diameter
of 0.60 mm
larger than
drilled hole
size. In limited
cases we can go
lower.
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ii. |
Remove unused
pads in
clearance area. |
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b) |
Connection pads (thermal
pads) : |
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i. |
Internal pad
size to be :
drilled hole
size plus 0.30
mm for 0.25 mm
min. annular
ring. |
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ii. |
Outside diameter
to be : internal
pad size plus
0.50 mm. |
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iii. |
Specify :
Number of spokes
: 4 preferred
Width of spokes
: 0.20 mm
Degree of spokes
: 45 |
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c) |
Routing clearance around
perimeter of finished
board. The " unclad area"
area around the edge of
the boards must be equal
to or greater than 0.64
mm on all ground and
power layers. |
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d) |
Label clearly on the
artwork the layer number
and description (i.e.,
L1, L2, L3, L4 and etc.) |
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Major Production Process and Equipment
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Lamination :
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Press Control |
Pressing |
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Drilling :
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Drilling |
Pre-treatment |
Exposure |
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Plating :
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Plating |
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Profiling :
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CNC Routing |
CNC V-cut |
Punching |
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Testing / Inspection :
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Inspection |
Electrical Test |
V-cut Inspection |
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FQC |
Tensile Tester |
Micro-score |
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AOI |
Flying Probe |
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